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Homepage Exhibitions China Shenzhen IC Packaging Fair 2026
Exhibitions China Shenzhen IC Packaging Fair 2026

IC Packaging Fair 2026 - выставка упаковки электроники и микросхем

IC Packaging Fair 2026 - выставка упаковки электроники и микросхем

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China, Shenzhen , Shenzhen World Exhibition & Convention Center
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Electronics, Packaging, Electronic components, Assembly, Packaging equipment, Microelectronics, Cables & wires, Packing machines, Package materials, Sensors, Integrated circuits & systems, Software, Nanotechnology, Packaging, Labels

About the exhibition IC Packaging Fair 2026

Выставка IC Packaging Fair. Технологии и оборудование для ламинирования, оборудование для пайки, контрольно-измерительное оборудование, Лабораторное контрольно-измерительное оборудование, оборудование для тестирования и измерения печатных плат, оборудование для тестирования и измерения готовой продукции...
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RX China
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